Process for coating an integrated circuit device with a molten s

Details Process for coating an integrated circuit device with a molten s Process for coating an integrated circuit device with a molten s

1995-10-27

1999-03-02

Graybill, David

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Multiple layers

438763, 438782, 438785, 438780, H01L 2156

Patent

active

058770933

ABSTRACT:
Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.

REFERENCES:
patent: 3844729 (1974-10-01), Sedlatschek et al.
patent: 4486945 (1984-12-01), Aigoo
patent: 4962152 (1990-10-01), Leempoel
patent: 4963751 (1990-10-01), Kano et al.
patent: 5053992 (1991-10-01), Gilberg et al.
patent: 5057900 (1991-10-01), Yamazaki
patent: 5208467 (1993-05-01), Yamazaki
patent: 5227111 (1993-07-01), Brangers et al.
patent: 5258334 (1993-11-01), Lantz II
patent: 5285967 (1994-02-01), Weidman
patent: 5302671 (1994-04-01), Cifuentes et al.
patent: 5352491 (1994-10-01), Cifuentes et al.
patent: 5399441 (1995-03-01), Bearinger et al.
patent: 5420222 (1995-05-01), Stepp et al.
patent: 5425947 (1995-06-01), Hautekeer et al.
patent: 5451814 (1995-09-01), Yoshimizu
patent: 5710203 (1998-01-01), Camilletti et al.
patent: 5720818 (1998-02-01), Donde et al.

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