Process for attaching a lead frame to a semiconductor chip

Details Process for attaching a lead frame to a semiconductor chip Process for attaching a lead frame to a semiconductor chip

1996-02-09

1998-12-15

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438118, 438123, 438465, H01L 2156, H01L 2160

Patent

active

058496076

ABSTRACT:
A method for manufacturing of a lead-on-chip type semiconductor chip package is disclosed, which comprises the steps of coating a liquid polyimide coating material on the bonding faces of at least one of the inner leads and the bus bars of the lead frame and the semiconductor chip, attaching the semiconductor chip by using the cured liquid polyimide coating material as an attaching medium, and forming a package body for wrapping and protecting the semiconductor chip and bonding wires. Since the liquid polyimide coating material protects the wafer from which the chips are obtained and also serves as a bonding agent for the semiconductor chip at the same time, the semiconductor chip package according to the present invention can be protected from damage, such as by air bubbles, which are generated at the interface of the conventional polyimide tape, and by separation and expansion of adhesives. Consequently, the method is applicable to a semiconductor chip package having a thickness that is thinner than that of conventional semiconductor chip package.

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patent: 5406124 (1995-04-01), Morita et al.
patent: 5457071 (1995-10-01), Dombroski

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