4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Jae Myung Park

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Method for performing a burn-in test

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Process for attaching a lead frame to a semiconductor chip

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-1476999

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