Process control in electrochemically assisted planarization

Details Process control in electrochemically assisted planarization Process control in electrochemically assisted planarization

2007-11-13

2007-11-13

Thomas, David B. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S526000, C451S285000, C204S22400M

Reexamination Certificate

active

11425339

ABSTRACT:
In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. The second conductive layer may have a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. In one example, the intermediate layer may contain a plurality of perforations or cannels that have a diameter within a range from about 0.5 mm to about 10 mm.

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