Process control in electrochemically assisted planarization

Details Process control in electrochemically assisted planarization Process control in electrochemically assisted planarization

2005-02-01

2005-02-01

Thomas, David B. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S036000

Reexamination Certificate

active

06848970

ABSTRACT:
Aspects of the invention generally provide a method for polishing a material layer using electrochemical deposition techniques, electrochemical dissolution techniques, polishing techniques, and/or combinations thereof. In one aspect of the invention, the polishing method comprises applying a separate electrical bias, such as a voltage, to each of a plurality of zones of an electrode. Determining the separate biases comprises determining a time that at least one portion of the material layer is associated with each of the zones of the counter-electrode.

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