Process chamber apparatus

Details Process chamber apparatus Process chamber apparatus

1998-11-05

2000-03-14

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118728, C23C 1600

Patent

active

060358041

ABSTRACT:
A process chamber apparatus includes a process chamber for processing a target such as a semiconductor wafer contained therein. The chamber includes an upper process chamber section having an annular contact surface at a lower end thereof and a lower process chamber section having an annular contact surface at an upper end thereof. A support mechanism supports the process chamber such that the lower section is movable against the upper section in a lateral direction between a process position where both sections are combined with each other and a separation position where both of the sections are separated apart from each other in a lateral direction. The contact surfaces of the upper and lower process chamber sections are inclined with respect to a plane including a movement direction of the lower process chamber section and are brought into contact with each other throughout entire circumferences of the contact surfaces at the process position.

REFERENCES:
patent: 5480052 (1996-01-01), Furr et al.

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