Process and system to package residual quantities of wafer...

Classifying – separating – and assorting solids – Sorting special items – and certain methods and apparatus for... – Condition responsive means controls separating means

Reexamination Certificate

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Reexamination Certificate

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06861608

ABSTRACT:
Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4907701 (1990-03-01), Kobayashi et al.
patent: 5313156 (1994-05-01), Klug et al.
patent: 5484062 (1996-01-01), Rich
patent: 5743695 (1998-04-01), Ryu
patent: 6685073 (2004-02-01), McKenna et al.
patent: 20020182759 (2002-12-01), Yamagata et al.
patent: 20030060025 (2003-03-01), Tieber
patent: 20030188997 (2003-10-01), Tan et al.

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