Process and apparatus for treating wafers

Details Process and apparatus for treating wafers Process and apparatus for treating wafers

2011-01-18

2011-01-18

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Combined with the removal of material by nonchemical means

C438S660000, C438S680000, C438S723000, C257SE21002

Reexamination Certificate

active

07871937

ABSTRACT:
Methods and systems are provided for low pressure baking to remove impurities from a semiconductor surface prior to deposition. Advantageously, the short, low temperature processes consume only a small portion of the thermal budget, while still proving effective at removing interfacial oxygen from the semiconductor surface. The methods and systems are particularly well suited for treating semiconductor surfaces before epitaxy.

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