Probeless testing of pad buffers on wafer

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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C714S729000

Reexamination Certificate

active

07574641

ABSTRACT:
The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

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