Probe card for integrated circuit chip and method of making prob

Details Probe card for integrated circuit chip and method of making prob Probe card for integrated circuit chip and method of making prob

1988-10-26

1990-11-06

Dees, Jose

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430319, 430258, 204 15, 324158P, G03C 500, G01R 1900

Patent

active

049685899

ABSTRACT:
Probes are formed on a support in a pattern to engage pads on an integrated circuit chip and leads on a printed circuit board. As a preliminary step, a thin layer of a conductive material may be formed on the support. The probes may then be formed by (a) providing facsimiles of the probes on a disposable member, (b) providing a photoresist on the support, (c) adhering the facsimiles to the support in a relationship providing for an easier removal of the disposable member from the facsimiles than the support, (d) developing the photoresist in the areas not occupied on the support by the facsimiles, (e) removing the disposable member, and then the facsimiles, from the support, (f) forming the probes on the support in the spaces previously occupied by the facsimiles and (g) removing the photoresist from the support. The probes (and the thin conductive layer) may then be transferred to a first surface of a dielectric substrate as by adhering an epoxy to the probes and the dielectric substrate and curing the epoxy. The probes (and the thin conductive layer) may then be removed from the support because the epoxy has a greater affinity to the dielectric substrate than to the support. The thin conductive layer may then be removed from the spaces between the probes; a ground plane may be formed on the opposite surface of the dielectric substrate; and contacts may be formed on the opposite ends of the probes to engage the chip pads and the board leads. The probe cards formed by such methods are also within the invention.

REFERENCES:
patent: 3669665 (1972-06-01), Faigenbaum et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4649338 (1987-03-01), Dugan
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4757256 (1988-07-01), Whann et al.
patent: 4878294 (1989-11-01), Dugan et al.
Barsetti et al., "New Probe Cards Replace Needle Types," Semiconductor Internat., Aug. 1988, pp. 98-101.

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