Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-09-27
2005-09-27
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S787000, C257S790000
Reexamination Certificate
active
06949836
ABSTRACT:
The present invention provides a printed circuit board which is capable of air-tightly sealing a functional surface of a device and of preventing excessive stress from acting on the device itself or a conductive bump conjugating the device with a wiring board and a method of fabricating the printed circuit board. The printed circuit board has a device mounted in a hollow formed in a wiring board via a plurality of conductive bumps. In the printed circuit board, a gap is formed between a functional surface of the device and an inner surface of the hollow, and a sealing member is disposed around side surfaces of the device so as to air-tightly isolate the gap and a space within the hollow excepting the gap.
REFERENCES:
patent: 6143496 (2000-11-01), Brown et al.
patent: 6214644 (2001-04-01), Glenn
patent: 6562662 (2003-05-01), Shishido et al.
patent: 2003/0080437 (2003-05-01), Gonzalez et al.
Depke Robert J.
Nguyen Dilinh
Sony Corporation
Trexler, Bushnell, Giangiorgi, Blackstone & Marr
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