Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2006-09-26
2006-09-26
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C257S762000
Reexamination Certificate
active
07112540
ABSTRACT:
The present invention provides an electroplating process and a method for manufacturing an integrated circuit. The electroplating process includes, among other steps, placing a substrate290in an enclosure200being substantially devoid of unwanted contaminants and forming a material layer310over the substrate290within the enclosure200,the enclosure200still being substantially devoid of the unwanted contaminants. The electroplating process further includes forming a thin layer of oxide410over the material layer310within the enclosure200, the enclosure200still being substantially devoid of the unwanted contaminants during the forming the thin layer of oxide410.
REFERENCES:
patent: 2003/0034251 (2003-02-01), Chikarmane et al.
patent: 2005/0031876 (2005-02-01), Lu et al.
patent: 2005/0064708 (2005-03-01), May et al.
Guldi Richard L.
Ramappa Deepak
Brady III W. James
Garner Jacqueline J.
Huynh Andy
Lee Calvin
Telecky , Jr. Frederick J.
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