Metal fusion bonding – Process – Diffusion type
Patent
1995-08-07
1998-09-01
Ramsey, Kenneth J.
Metal fusion bonding
Process
Diffusion type
228205, 228221, 2282627, B23K 2014, B23K 2016
Patent
active
057998604
ABSTRACT:
A sputtering target assembly is fabricated by diffusion bonding a target material plate to a backing plate. The plates are cleaned in a vacuum environment, and an interlayer is formed on one or more of the plates. The plates are then joined under heat and pressure, before an oxide layer can form on the joining surfaces of the plates. The plates may be sequentially processed through cleaning, interlayer deposition, and bonding chambers, all with vacuum environments, to form the finished part, or, a single chamber may be used to provide the cleaning, interlayer deposition and bonding functions.
REFERENCES:
patent: H340 (1987-10-01), MacKenzie et al.
patent: 3672045 (1972-06-01), Robertson
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3713207 (1973-01-01), Ruckle et al.
patent: 3762032 (1973-10-01), Bowling et al.
patent: 3971875 (1976-07-01), Regalbuto
patent: 4011982 (1977-03-01), Marancik
patent: 4087037 (1978-05-01), Schier et al.
patent: 4088258 (1978-05-01), Regalbuto
patent: 4089456 (1978-05-01), Toppen et al.
patent: 4166563 (1979-09-01), Peyraud et al.
patent: 4220276 (1980-09-01), Weisert et al.
patent: 4245769 (1981-01-01), Meginnis
patent: 4691857 (1987-09-01), Friedman
patent: 4709844 (1987-12-01), Sekiguchi et al.
patent: 4756680 (1988-07-01), Ishiii
patent: 4869421 (1989-09-01), Norris et al.
patent: 4921666 (1990-05-01), Ishii
patent: 4934579 (1990-06-01), Doble
patent: 4948031 (1990-08-01), De Clerck
patent: 5058411 (1991-10-01), Siemers et al.
patent: 5151332 (1992-09-01), De Clerck
patent: 5161908 (1992-11-01), Yoshida et al.
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5263638 (1993-11-01), Douglas
patent: 5269899 (1993-12-01), Fan
patent: 5433835 (1995-07-01), Demaray et al.
patent: 5487822 (1996-01-01), Demaray et al.
Demaray Richard Ernest
Herrera Manuel J.
Hosokawa Akihiro
Applied Materials Inc.
Guenzer Charles S.
Ramsey Kenneth J.
Verplancke Donald E.
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