Preheating of chemical vapor deposition precursors

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S685000, C427S255391, C427S255394

Reexamination Certificate

active

07105441

ABSTRACT:
Chemical vapor deposition systems include elements to preheat reactant gases prior to reacting the gases to form layers of a material on a substrate, which provides devices and systems with deposited layers substantially free of residual compounds from the reaction process. Heating reactant gases prior to introduction to a reaction chamber may be used to improve physical characteristics of the resulting deposited layer, to improve the physical characteristics of the underlying substrate and/or to improve the thermal budget available for subsequent processing. One example includes the formation of a titanium nitride layer substantially free of ammonium chloride using reactant gases containing a titanium tetrachloride precursor and a ammonia precursor.

REFERENCES:
patent: 4031851 (1977-06-01), Camahort
patent: 4522674 (1985-06-01), Ninomiya et al.
patent: 4535000 (1985-08-01), Gordon
patent: 4629635 (1986-12-01), Brors
patent: 4717596 (1988-01-01), Barbee et al.
patent: 4897709 (1990-01-01), Yokoyama et al.
patent: 4920908 (1990-05-01), Brors et al.
patent: 4947789 (1990-08-01), Hussla et al.
patent: 5015503 (1991-05-01), Varrin, Jr. et al.
patent: 5094977 (1992-03-01), Yu et al.
patent: 5116784 (1992-05-01), Ushikawa
patent: 5186120 (1993-02-01), Ohnishi et al.
patent: 5188979 (1993-02-01), Filipiak
patent: 5203925 (1993-04-01), Shibuya et al.
patent: 5254499 (1993-10-01), Sandhu et al.
patent: 5279857 (1994-01-01), Eichman et al.
patent: 5308655 (1994-05-01), Eichman et al.
patent: 5318633 (1994-06-01), Yamamoto et al.
patent: 5378501 (1995-01-01), Foster et al.
patent: 5431733 (1995-07-01), Shibuya et al.
patent: 5458688 (1995-10-01), Watanabe
patent: 5567483 (1996-10-01), Foster et al.
patent: 5571572 (1996-11-01), Sandhu
patent: 5630878 (1997-05-01), Miyamoto et al.
patent: 5674574 (1997-10-01), Atwell et al.
patent: 5730804 (1998-03-01), Gomi et al.
patent: 5741546 (1998-04-01), Sandhu
patent: 5741547 (1998-04-01), Akram et al.
patent: 5840368 (1998-11-01), Ohmi
patent: 5892886 (1999-04-01), Sandhu
patent: 5943471 (1999-08-01), Atwell
patent: 5946594 (1999-08-01), Iyer et al.
patent: 5989345 (1999-11-01), Hatano
patent: 6055927 (2000-05-01), Shang et al.
patent: 6056823 (2000-05-01), Sajoto et al.
patent: 6107152 (2000-08-01), Derderian
patent: 6129043 (2000-10-01), Lai et al.
patent: 6133159 (2000-10-01), Vaartstra et al.
patent: 6143081 (2000-11-01), Shinriki et al.
patent: 6147011 (2000-11-01), Derderian et al.
patent: 6159855 (2000-12-01), Vaartstra
patent: 6165834 (2000-12-01), Agarwal et al.
patent: 6177145 (2001-01-01), Derderian et al.
patent: 6180541 (2001-01-01), Joo
patent: 6188097 (2001-02-01), Derderian et al.
patent: 6206971 (2001-03-01), Umotoy et al.
patent: 6210485 (2001-04-01), Zhao et al.
patent: 6244575 (2001-06-01), Vaartstra et al.
patent: 6268019 (2001-07-01), Florczak
patent: 6364954 (2002-04-01), Umotoy et al.
patent: 6365229 (2002-04-01), Robbins
patent: 6428850 (2002-08-01), Shinriki et al.
patent: 6444039 (2002-09-01), Nguyen
patent: 6451692 (2002-09-01), Derderian et al.
patent: 6454860 (2002-09-01), Metzner et al.
patent: 2002/0195710 (2002-12-01), Derderian et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Preheating of chemical vapor deposition precursors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Preheating of chemical vapor deposition precursors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Preheating of chemical vapor deposition precursors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3561634

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.