Power semiconductor module having a plurality of semiconductor a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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Details

257692, 257723, 257776, 361760, 361778, 361784, H01L 2316, H01L 2348

Patent

active

054593565

ABSTRACT:
A plurality of semiconductor arrangements arranged on interconnects are cected parallel to one another in a module. The arrangements lie opposite one another in pairs. At least one pair and at most two pairs of semiconductor arrangements are arranged to follow one another in the direction of an axis of the module and are further connected to lead conductors. Positions of the lead conductors with respect to the contacted semiconductor arrangements are the same for each pair of semiconductor arrangements or, respectively, two respective pairs of semiconductor arrangements. Corresponding lead conductors are connected to one another above the interconnects.

REFERENCES:
patent: 4423434 (1983-12-01), Komatsu
patent: 4670833 (1987-06-01), Sachs
patent: 4816984 (1989-03-01), Porst et al.
patent: 4907068 (1990-03-01), Amann et al.
patent: 5264727 (1993-04-01), Kudou et al.
patent: 5266826 (1993-11-01), Umeyama

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