Power loading substrates to reduce particle contamination

Details Power loading substrates to reduce particle contamination Power loading substrates to reduce particle contamination

2006-06-29

2011-12-13

Gambetta, Kelly M (Department: 1715)

Coating processes

Coating by vapor, gas, or smoke

C427S569000

Reexamination Certificate

active

08075952

ABSTRACT:
A method for preventing particle contamination within a processing chamber is disclosed. Preheating the substrate within the processing chamber may cause a thermophoresis effect so that particles within the chamber that are not adhered to a surface may not come to rest on the substrate. One method to increase the substrate temperature is to plasma load the substrate. Plasma loading comprises providing an inert gas plasma to the substrate to heat the substrate. Another method to increase the substrate temperature is high pressure loading the substrate. High pressure loading comprises heating the substrate while increasing the chamber pressure to between about 1 Torr and about 10 Torr. By rapidly increasing the substrate temperature within the processing chamber prior to substrate processing, particle contamination is less likely to occur.

REFERENCES:
patent: 4872947 (1989-10-01), Wang et al.
patent: 5380566 (1995-01-01), Robertson et al.
patent: 5844205 (1998-12-01), White et al.
patent: 5931721 (1999-08-01), Rose et al.
patent: 5967156 (1999-10-01), Rose et al.
patent: 6106634 (2000-08-01), Ghanayem et al.
patent: 6192601 (2001-02-01), Ghanayem et al.
patent: 6203406 (2001-03-01), Rose et al.
patent: 6379572 (2002-04-01), Kikuchi et al.
patent: 6559026 (2003-05-01), Rossman et al.
patent: 2003/0032301 (2003-02-01), Dhindsa et al.

Affiliated with

Also associated with

Rating

Power loading substrates to reduce particle contamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power loading substrates to reduce particle contamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power loading substrates to reduce particle contamination will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4272385