Post seal etching of transducer diaphragm

Details Post seal etching of transducer diaphragm Post seal etching of transducer diaphragm

1987-08-24

1989-10-10

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156633, 361283, 73718, 73724, 29594, 29595, H04R 3100

Patent

active

048729450

ABSTRACT:
A process for manufacturing a pressure transducer of a pressure sensor is disclosed. Initially, a capacitive pressure transducer is formed by bonding a silicon diaphragm to a glass base such that the transducer produces different capacitances in response to different diaphragm deflections provided in response to sensed pressures. The sensitivity of the capacitive pressure transducer is adjusted by etching the silicon diaphragm while it is bonded to the base substrate in accordance with capacitance values of the transducer which were previously obtained at various predetermined pressures. In this manner, the thickness of the silicon diaphragm is selectively reduced to obtain an accurate desired sensitivity for the transducer and handling of very thin silicon diaphragms prior to their assembly to associated transducer bases is eliminated.

REFERENCES:
patent: 4016437 (1977-04-01), Calderara et al.
patent: 4238662 (1980-12-01), Lao
patent: 4384899 (1983-05-01), Myers
patent: 4586109 (1986-04-01), Peters et al.
patent: 4617606 (1986-10-01), Shat et al.
Websters Ninth New Collegiate Dictionary Merriam Webster Inc., Mass. 1985, pp. 48 and 1313.

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