Positive resist compositions and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S330000, C430S910000

Reexamination Certificate

active

07638260

ABSTRACT:
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units. When processed by ArF lithography, the composition is improved in resolution and forms a pattern with a minimal line edge roughness.

REFERENCES:
patent: 5714625 (1998-02-01), Hada et al.
patent: 5902713 (1999-05-01), Hada et al.
patent: 6004724 (1999-12-01), Yamato et al.
patent: 6022666 (2000-02-01), Hada et al.
patent: 6063953 (2000-05-01), Hada et al.
patent: 6261738 (2001-07-01), Asakura et al.
patent: 6312867 (2001-11-01), Kinsho et al.
patent: 6329125 (2001-12-01), Takechi et al.
patent: 6512020 (2003-01-01), Asakura et al.
patent: 6586157 (2003-07-01), Hasegawa et al.
patent: 6673518 (2004-01-01), Nishi et al.
patent: 6916591 (2005-07-01), Ohsawa et al.
patent: 7531290 (2009-05-01), Kobayashi et al.
patent: 2005/0227174 (2005-10-01), Hatakeyama et al.
patent: 2005/0282083 (2005-12-01), Funatsu et al.
patent: 2007/0148594 (2007-06-01), Funatsu et al.
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 9-95479 (1997-04-01), None
patent: 9-230588 (1997-09-01), None
patent: 9-301948 (1997-11-01), None
patent: 2906999 (1999-06-01), None
patent: 2000-314956 (2000-11-01), None
patent: WO-2004/074242 (2004-09-01), None
J. Photoplym. Sci. and Tech., vol. 8, pp. 43-44, 45-46 (1995).
J. Photoplym. Sci. and Tech., ibid., vol. 9, pp. 29-30 (1996).
J. Photoplym. Sci. and Tech., vol. 19, No. 3, 2006, pp. 313-318.
J. Photoplym. Sci. and Tech., vol. 19, No. 3, 2006, pp. 327-334.
J. Photoplym. Sci. and Tech., vol. 18, No. 3, 2005, pp. 381-387.

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