Positive resist composition and pattern forming method

Details Positive resist composition and pattern forming method Positive resist composition and pattern forming method

2008-03-27

2011-10-11

Kelly, Cynthia (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S905000, C430S907000, C430S910000, C430S281100

Reexamination Certificate

active

08034537

ABSTRACT:
A positive photosensitive composition comprises:(A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid;(B) a compound that generates an acid in irradiation with actinic light or radiation;(C) a resin that has: at least one of a fluorine atom and a silicon atom; and a group selected from the group consisting of groups (x) to (z); and(D) a solvent:(x) an alkali soluble group,(y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and(z) a group which decomposes by action of an acid,wherein,Xa1represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom,Ry1to Ry3each independently represents an alkyl group or a cycloalkyl group, and at least two of Ry1to Ry3may be coupled to form a ring structure, andZ represents a divalent linking group.

REFERENCES:
patent: 4480910 (1984-11-01), Takanashi et al.
patent: 2003/0054286 (2003-03-01), Sato et al.
patent: 2005/0014090 (2005-01-01), Hirayama et al.
patent: 2005/0123859 (2005-06-01), Wada et al.
patent: 2006/0008736 (2006-01-01), Kanda et al.
patent: 2006/0264528 (2006-11-01), Wada
patent: 2007/0065753 (2007-03-01), Mizutani et al.
patent: 2007/0082289 (2007-04-01), Wada
patent: 2007/0178405 (2007-08-01), Kanda et al.
patent: 2008/0171287 (2008-07-01), Kanda et al.
patent: 2008/0305433 (2008-12-01), Kanda et al.
patent: 2010/0068661 (2010-03-01), Kanna et al.
patent: 1536285 (2005-06-01), None
patent: 1621927 (2006-02-01), None
patent: 1754999 (2007-02-01), None
patent: 1767992 (2007-03-01), None
patent: 1903394 (2008-03-01), None
patent: 57-153433 (1982-09-01), None
patent: 2002-303978 (2002-10-01), None
patent: 2004-302200 (2004-10-01), None
patent: 2004341061 (2004-12-01), None
patent: 2005077811 (2005-03-01), None
patent: 2005173549 (2005-06-01), None
patent: 2006048029 (2006-02-01), None
patent: 2006178172 (2006-07-01), None
patent: 2006330098 (2006-12-01), None
patent: 2007003619 (2007-01-01), None
patent: 2007065024 (2007-03-01), None
patent: 2007086528 (2007-04-01), None
patent: 2007304537 (2007-11-01), None
patent: 2008107806 (2008-05-01), None
patent: 2004/068242 (2004-08-01), None
patent: 2005/003198 (2005-01-01), None
Japanese Office Action, Application No. 2008076598, dated Jul. 13, 2010.
Japanese Office Action dated Apr. 6, 2010 issued in corresponding Application No. JP 2008-76598.
International Search Report dated Aug. 21, 2008—PCT/ISA/210, English.
Written Opinion—PCT/ISA/237, English.
J.A. Hoffnagle et al. “Liquid immersion deep-ultraviolet interferometric lithography”, Journal of Vacuum Science Technology, 17(6), Nov./Dec. 1999. pp. 3306-3309, English.
B.J. Lin, “Semiconductor Foundry, Lithography, and Partners”, Proceedings of the International Society for Optical Engineering (SPIE Proc.), vol. 4688, 2002, pp. 11-24, English.
Hiroshi Ito, et al. “Dissolution/swelling behavior of cycloolefin polymers in aqueous base”, Proceedings of the International Society for Optical Engineering (SPIE Proc.), vol. 3999, 2000, pp. 2-12, English.

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