Porous organosilicates with improved mechanical properties

Details Porous organosilicates with improved mechanical properties Porous organosilicates with improved mechanical properties

2007-06-12

2007-06-12

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C257SE21494, C438S782000

Reexamination Certificate

active

11031418

ABSTRACT:
Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3–6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.

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R.G. Jones et al. (eds.); “Silicon-Containing Polymers”, Chapter 10, Polycarbosilanes L.V. Interrante, et al; (2000) Kluwer Academic Publishers, Boston 2000, p. 247-249; 316-321.

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