Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-10-12
2009-10-20
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S272100, C430S273100, C430S325000, C430S326000, C430S330000, C526S279000
Reexamination Certificate
active
07604917
ABSTRACT:
A polymer, a top coating layer, a top coating composition and an immersion lithography process using the same are provided. The polymer used as a top coating layer covering (or formed on) a photoresist may include a specific chemical structure. The top coating composition may include a solvent and a polymer of having the specific chemical structure. The immersion lithography process includes forming a photoresist layer on a wafer, forming a top coating layer on the photoresist layer, immersing the wafer in water, performing an exposure process on the photoresist layer and forming a photoresist pattern by removing the top coating layer and the photoresist layer with a developer.
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Tegou et al (“Polyhedral Oligomeric Silsesquioxane (POSS) Based Resists: Material Design Challenges and Lithographic Evaluation at 157 nm”, Chemistry of Materials, vol. 16, pp. 2567-2577 (2004)).
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Korean Office Action dated Oct. 24, 2006 for counterpart Korean Application No. 10-2005-0096077 with English Translation.
Cho Han-Ku
Choi Sang-Jun
Harness & Dickey & Pierce P.L.C.
Lee Sin J.
Samsung Electronics Co,. Ltd.
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