Polymer removal from top surfaces and sidewalls of a semiconduct

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

216 70, 216 75, 438711, 438725, H01L 21302, B08B 600

Patent

active

060622377

ABSTRACT:
A process for producing a strip removes photoresist and extraneous deposits of polymer residue on the top surface and sidewalls of a post-metal etch wafer. The photoresist and residue are processed simultaneously by a chemical mechanism comprising reactive species derived from a microwave-excited fluorine-containing downstream gas, and a physical mechanism comprising ion bombardment that results from a radio frequency excited plasma and accompanying wafer self bias. A vacuum pump draws stripped photoresist and residues from the surface of the wafer and exhausts them from the chamber.

REFERENCES:
patent: 4875989 (1989-10-01), Davis et al.
patent: 4983254 (1991-01-01), Fujimura et al.
patent: 5382316 (1995-01-01), Hills et al.
patent: 5780359 (1998-07-01), Brown et al.
patent: 5792314 (1998-08-01), Shima et al.
patent: 5811022 (1998-09-01), Savas et al.
"A Dry Process for Stripping As.sup.+ IonImplanted Photoresist"; Jap. J. of Appl. Phys.; Part 1 (Regular Papers & Short Notes) (Jun. 1992), vol. 31, No. 6B, pp. 2035-2040.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polymer removal from top surfaces and sidewalls of a semiconduct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymer removal from top surfaces and sidewalls of a semiconduct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer removal from top surfaces and sidewalls of a semiconduct will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-250486

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.