Polymer for photoresist, photoresist composition containing the

Details Polymer for photoresist, photoresist composition containing the Polymer for photoresist, photoresist composition containing the

1998-12-22

2000-04-04

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430905, 430910, 5263231, G03F 7004

Patent

active

060459700

ABSTRACT:
A polymer for use in making a chemically amplified photoresist, a photoresist composition containing the polymer, and a method of preparing the same. The polymer for a photoresist is formed by polymerizing three or more different monomers and it has an acid-labile di-alkylmalonate group bound to the backbone of the polymer. The polymer can be used to form a photoresist composition that includes the polymer and a photosensitive acid generator. The photoresist composition is suitable for forming a pattern having an excellent profile due to the high contrast and high thermal decomposition temperature of the photoresist composition.

REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 5324804 (1994-06-01), Steinmann
patent: 5368976 (1994-11-01), Tajima et al.
patent: 5733704 (1998-03-01), Choi et al.
patent: 5738975 (1998-04-01), Nakano et al.
patent: 5847063 (1998-12-01), Choi et al.

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