Polymer film metalization

Details Polymer film metalization Polymer film metalization

2005-05-10

2005-05-10

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S003000

Reexamination Certificate

active

06890813

ABSTRACT:
Embodiments in accordance with the present invention eliminate the need for a subtractive metal patterning process to pattern the electrode above a ferroelectric polymer. Instead, a selective electroless deposition process is used. A conductive polymer is used as a seed layer for the electroless plating of the metal electrode. A cost saving is provided by eliminating the chemical costs associated with conventional resist removal processing. The methods also potentially eliminate the requirement for aggressive and environmentally unsafe chemical-based photoresist removal processes.

REFERENCES:
patent: 5877072 (1999-03-01), Andideh et al.
patent: 5953635 (1999-09-01), Andideh
patent: 6121100 (2000-09-01), Andideh et al.
patent: 6178034 (2001-01-01), Allemand et al.
patent: 6191050 (2001-02-01), Andideh
patent: 6235568 (2001-05-01), Murthy et al.
patent: 6316063 (2001-11-01), Andideh et al.
patent: 6350670 (2002-02-01), Andideh et al.
patent: 6362091 (2002-03-01), Andideh et al.
patent: 6380010 (2002-04-01), Brigham et al.
patent: 6437444 (2002-08-01), Andideh
patent: 6448185 (2002-09-01), Andideh et al.
patent: 6482754 (2002-11-01), Andideh et al.
patent: 6506692 (2003-01-01), Andideh
patent: 6596646 (2003-07-01), Andideh et al.
patent: 6620657 (2003-09-01), Breen et al.
patent: 6624032 (2003-09-01), Alavi et al.
patent: 6630390 (2003-10-01), Andideh et al.
patent: 6734478 (2004-05-01), Johansson et al.
patent: 20030064607 (2003-04-01), Leu et al.

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