Polyimide resin precursor solution, laminates for electronic...

Details Polyimide resin precursor solution, laminates for electronic... Polyimide resin precursor solution, laminates for electronic...

2006-12-05

2006-12-05

McClendon, Sanza L. (Department: 1711)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S280100, C522S150000, C522S152000, C522S162000, C522S164000, C522S176000, C522S170000, C427S517000, C427S403000, C427S404000, C427S508000, C427S407100, C427S418000, C427S419100

Reexamination Certificate

active

07144679

ABSTRACT:
Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

REFERENCES:
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patent: 5175399 (1992-12-01), Mori
patent: 5916632 (1999-06-01), Mishina et al.
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patent: 03-208393 (1991-09-01), None
patent: 05-306469 (1993-11-01), None
patent: 07-070762 (1995-03-01), None
patent: 07-216225 (1995-08-01), None
patent: 2001-073159 (2001-03-01), None
International Search Report for PCT/JP01/11613 mailed on Feb. 12, 2002.

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