4. Plastic article or earthenware shaping or treating: apparatus
  5. Shaping orifice and downstream work contacting gaseous...
  6. Orifice for filaments or fibers

Toray Engineering Company, Limited

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Chip mounting device

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Laser exposure apparatus

Photocopying – Projection printing and copying cameras – Step and repeat
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Melt spinning apparatus

Plastic article or earthenware shaping or treating: apparatus – Shaping orifice and downstream work contacting gaseous... – Orifice for filaments or fibers
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Method of fabricating a COF utilizing a tapered IC chip and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Method of resin-sealing electronic parts, and stencil...

Printing – Stenciling – Processes
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Profile ID: LFUS-PAI-P-2716143

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