Polyimide patterning

Details Polyimide patterning Polyimide patterning

1996-02-12

1998-04-28

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430156, 430166, 430312, 430330, G03F 730, G03F 740

Patent

active

057442860

ABSTRACT:
Disclosed is a method of making a polyimide pattern on a substrate. A solution is prepared in an organic solvent of a polyamic acid and about 1 to about 10 wt. % of a photosensitizer that becomes more water soluble when exposed to actinic light. A coating is formed of the solution on a substrate and solvent is evaporated from the coating. A positive photoresist is applied over the coating and is exposed to a pattern of actinic light. The exposed portions of the photoresist are removed as well as the exposed portions of the polyamic acid coating thereunder. The remaining photoresist is removed and the polyamic acid coating is imidized.

REFERENCES:
patent: 5177181 (1993-01-01), Rosenfeld et al.
patent: 5393864 (1995-02-01), Summers
Article by Toyhiko Abe et al. in J. Photopolym. Sci. Technol. 5(2), 327-34 (1992).

Affiliated with

Also associated with

Rating

Polyimide patterning does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide patterning, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide patterning will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1530865