Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1987-09-04
1989-05-09
Michl, Paul R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430313, 430311, 430314, 430323, 430324, 528351, 524 84, 524 93, 524606, 524600, 524110, G03C 190, G03C 516
Patent
active
048289647
ABSTRACT:
A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling point greater than 160.degree. C. and a low boiling organic compound (70.degree.-150.degree. C.) may be incorporated in the composition.
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patent: 4362809 (1982-12-01), Chen et al.
patent: 4370405 (1983-01-01), O'Toole et al.
patent: 4433044 (1984-02-01), Meyer et al.
patent: 4606998 (1986-08-01), Clodgo et al.
Yoshio Homma, Hisao Nozawa, Seiki Harada, "Polyimide Liftoff Technology for High-Density LSI Metallization", IEEE Transactions on Electron Devices, vol. ED-28, No. 5, May 1981, pp. 552-556.
Brunsvold William R.
Conley Willard E.
Jacobs Scott L.
Mack George L.
Merritt David P.
Hamilton Cynthia
International Business Machines - Corporation
Michl Paul R.
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