Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2011-08-09
2011-08-09
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S303000, C438S305000, C438S308000, C257S204000, C257S369000, C257SE21632
Reexamination Certificate
active
07993997
ABSTRACT:
The present invention provides a method of inducing stress in a semiconductor device substrate by applying an ion implantation to a gate region before a source/drain annealing process. The source/drain region may then be annealed along with the gate which will cause the gate to expand in certain areas due to said ion implantation. As a result, stress caused by said expansion of the gate is transferred to the channel region in the semiconductor substrate.
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Ho Vincent
Lin Wenhe
Sheng Haifeng
Siew Yong Kong
Tan Juan Boon
Globalfoundries Singapore Pte. Ltd.
Horizon IP Pte. Ltd.
Lee Hsien-Ming
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