Polishing system with in-line and in-situ metrology

Details Polishing system with in-line and in-situ metrology Polishing system with in-line and in-situ metrology

2006-09-05

2006-09-05

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

C451S006000, C451S008000, C451S041000

Reexamination Certificate

active

07101251

ABSTRACT:
A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.

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