Polishing system with in-line and in-situ metrology

Details Polishing system with in-line and in-situ metrology Polishing system with in-line and in-situ metrology

2005-09-06

2005-09-06

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S008000, C451S041000

Reexamination Certificate

active

06939198

ABSTRACT:
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.

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