Polishing pads useful for endpoint detection in chemical...

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Reexamination Certificate

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Details

C451S533000

Reexamination Certificate

active

10123917

ABSTRACT:
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.

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Boguslaw A. Swedek et al., “Polishing Pad For Eddy Current Monitoring”, U.S. Appl. No. 11/842,829, filed Aug. 21, 2007, 26 pp.

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