Polishing pad sensor assembly with a damping pad

Abrading – Precision device or process - or with condition responsive... – With indicating

Reexamination Certificate

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C451S006000, C451S526000, C451S041000

Reexamination Certificate

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06884150

ABSTRACT:
A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. A damping pad may be disposed on the optical assembly to reduce vibrations and further increase the sensitivity of optical measurements.

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