Polishing pad, platen, method of monitoring, method of...

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S010000, C451S011000, C451S041000

Reexamination Certificate

active

07442111

ABSTRACT:
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.

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A Korean Office Action dated Apr. 28, 2005 for counterpart Korean Patent Application No. 10-2003-0038740.

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