Polishing pad for use in chemical-mechanical planarization...

Paper making and fiber liberation – Processes and products

Reexamination Certificate

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C162S135000, C162S136000, C162S141000, C162S146000, C162S194000, C162S201000, C162S202000

Reexamination Certificate

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06863774

ABSTRACT:
A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.

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