Polishing method for semiconductors and apparatus therefor

Abrading – Abrading process – With tool treating or forming

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451 60, 451444, B24B 100

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active

060993936

ABSTRACT:
In the polishing machine 10 for pressing the polished surface 7 of the workpiece 1 against the face where there are abrasives 15 of the rotating polishing tool 11 and executing chemical mechanical polishing, the brushing device 30, the cleaner 40, the abrasive supplier 52, and the pure water supplier 60 are sequentially arranged behind the location of the head 20 for pressing the workpiece 1 against the polishing tool 11 in the rotational direction. The cleaner 40 sprays the cleaning water 47 to the face where there are abrasives 15 of the rotating polishing tool 11 and sucks and collects it by the vacuum hole 45. Fresh slurry 62 is always supplied by the slurry supplier 63 comprising the abrasive supplier 52 and the pure water supplier 60.

REFERENCES:
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5643067 (1997-07-01), Katsuoka et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5782675 (1998-07-01), Southwick
patent: 5860847 (1999-01-01), Sakurai et al.
patent: 5885137 (1999-03-01), Ploessl
patent: 5916010 (1999-06-01), Varian et al.
International Publication No. WO97/10613 published Mar. 20, 1997.

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