Polishing head for a chemical mechanical polishing apparatus

Abrading – Machine – Rotary tool

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Details

B24B 722

Patent

active

061590835

ABSTRACT:
A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.

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