Polishing apparatus including thickness or flatness detector

Details Polishing apparatus including thickness or flatness detector Polishing apparatus including thickness or flatness detector

1996-07-19

1998-11-17

Font, Frank G.

Optics: measuring and testing

By configuration comparison

With photosensitive film or plate

356426, 356371, 451 6, G01B 1106, G01B 1130, G01N 2184

Patent

active

058384472

ABSTRACT:
A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.

REFERENCES:
patent: 3671726 (1972-06-01), Kerr
patent: 3737237 (1973-06-01), Zurasky
patent: 5081796 (1992-01-01), Schultz
patent: 5351126 (1994-09-01), Takada et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5562529 (1996-10-01), Kishii et al.

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