Polishing apparatus and related polishing methods

Details Polishing apparatus and related polishing methods Polishing apparatus and related polishing methods

2006-05-03

2009-02-10

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S010000, C451S011000, C451S041000, C451S288000

Reexamination Certificate

active

07488235

ABSTRACT:
Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.

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Office Action for Korean Patent Application No. 10-2003-0001690; dated Jan. 28, 2005 (English Translation).
Office Action for Korean Patent Application No. 10-2003-0001690; dated Jan. 28, 2005.

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