Polishing apparatus and related polishing methods

Details Polishing apparatus and related polishing methods Polishing apparatus and related polishing methods

2006-06-27

2006-06-27

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S285000, C451S287000, C451S398000

Reexamination Certificate

active

07066785

ABSTRACT:
Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.

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