Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2007-01-23
2007-01-23
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S052000, C451S289000
Reexamination Certificate
active
11004991
ABSTRACT:
The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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Ishida Yoshihiro
Katagiri Soichi
Kawai Ryosei
Kugaya Takashi
Moriyama Shigeo
Grant Alvin J.
Hitachi , Ltd.
Kenyon & Kenyon LLP
Wilson Lee D.
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