Polishing apparatus

Details Polishing apparatus Polishing apparatus

1999-03-01

2000-06-13

Rachuba, M.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 41, 451270, 451287, 451294, B24B 4900

Patent

active

060742771

ABSTRACT:
A polishing apparatus prevents uneven wear of the platen and improves the operating rate of the apparatus. The polishing apparatus provided with a platen 1 divided into an inner peripheral platen portion 11 and an outer peripheral platen portion 13 and with a carrier 5, wherein by making the inner peripheral platen portion 11 and the outer peripheral platen portion 13 rotate in opposite directions and setting the rotational speeds of the inner peripheral platen portion 11 and the outer peripheral platen portion 13 so that the mean relative speed of a wafer 200 and the inner peripheral platen portion 11 and the mean relative speed of the wafer 200 and the outer peripheral platen portion 13 become substantially equal, it becomes possible to make the amount of wear of the polishing pad 11a of the inner peripheral platen portion 11 and the amount of wear of the polishing pad 13a of the outer peripheral platen portion 13 substantially equal. Preferably, the wafer 200 is made to oscillate so that the wafer 200 overhangs from the inner edge of the inner peripheral platen portion 11 and the outer edge of the outer peripheral platen portion 13.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 5134807 (1992-08-01), Keefe
patent: 5503592 (1996-04-01), Neumann
patent: 5733175 (1998-03-01), Leach

Affiliated with

Also associated with

Rating

Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2064412