Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-01-22
2008-01-22
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21114, C257SE21464, C427S437000, C427S443100
Reexamination Certificate
active
11156544
ABSTRACT:
An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.
REFERENCES:
patent: 4601916 (1986-07-01), Arachtingi
patent: 4888209 (1989-12-01), Neely
patent: 5239435 (1993-08-01), Jeffers et al.
patent: 5252195 (1993-10-01), Kobayashi et al.
patent: 5322751 (1994-06-01), Chou et al.
patent: 6238749 (2001-05-01), Willard et al.
patent: 6942901 (2005-09-01), Van Tassel et al.
patent: 2004/0151957 (2004-08-01), Brooks et al.
patent: 0239839 (1987-10-01), None
patent: 0373776 (1990-06-01), None
Electrophoretic Deposition by WWW.WIKIPEDIA.COM Search Word: Electrophoretic Deposition.
Brunet Magall
Connell Andrew Mark
McCloskey Paul
O'Donnell Terence
O'Mathuna Sean Cian
Coleman W. David
Kim Su C.
University College Cork - National University of Ireland, Cork
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