Plated probe structure

Electricity: measuring and testing – Testing potential in specific environment – Voltage probe

Reexamination Certificate

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Details

C324S754090, C029S854000

Reexamination Certificate

active

06891360

ABSTRACT:
A plated test probe structure for testing electrical connections to integrated circuits (IC) devices with solder bumped interconnection pads that are an integral part of the fan-out wiring on the test substrate, or other printed wiring device.

REFERENCES:
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5665650 (1997-09-01), Lauffer et al.
patent: 5785538 (1998-07-01), Beaman et al.
patent: 5811982 (1998-09-01), Beaman et al.

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