Plasma treatment method at atmospheric pressure

Details Plasma treatment method at atmospheric pressure Plasma treatment method at atmospheric pressure

2005-02-01

2005-02-01

Chen, Bret (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S562000

Reexamination Certificate

active

06849306

ABSTRACT:
A plasma treatment method for surface treatment of a substrate with an atmospheric pressure plasma treatment apparatus is disclosed. The apparatus has a first electrode and a second electrode opposed to each other, a discharge space between the opposed electrodes, a voltage application means for applying voltage across the discharge space, a gas supply means for supplying a reactive gas and an inert gas to the discharge space. The method is one wherein the reactive gas at the discharge space is excited at atmospheric pressure or at approximately atmospheric pressure by applying voltage through the voltage application means to generate discharge plasma, and a substrate is exposed to the discharge plasma to be subjected to surface treatment, and wherein the reactive gas is not directly in contact with the discharge surface of the first electrode or the second electrode.

REFERENCES:
patent: RE37294 (2001-07-01), Knapp et al.
patent: 6558889 (2003-05-01), Oishi et al.
patent: 6559070 (2003-05-01), Mandal
patent: 6652069 (2003-11-01), Toda et al.

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