Plasma treatment method and apparatus

Details Plasma treatment method and apparatus Plasma treatment method and apparatus

2006-01-31

2006-01-31

Zadeh, P. Hassan (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345520, C156S345530, C156S345340, C156S345290, C118S715000, C118S724000, C204S298310, C204S298320, C204S298330, C204S298340

Reexamination Certificate

active

06991701

ABSTRACT:
A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

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