Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means
Reexamination Certificate
2004-03-09
2009-11-10
Hassanzadeh, Parviz (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
Having glow discharge electrode gas energizing means
C156S345430, C156S345440, C156S345280, C118S7230ER
Reexamination Certificate
active
07615132
ABSTRACT:
A plasma processing apparatus suitable for high-speed and high-definition etching is provided. By applying to a wafer chucking electrode9a voltage waveform in which an absolute value of high frequency voltage increases with time and switching between a positive voltage and a negative voltage occurs, a rectangular high frequency voltage is caused to be generated in the wafer10, with the result that the duty ratio of the rectangular high frequency voltage decreases and that the high energy ion ratio in the energy distribution of ions incident on the wafer increases. Therefore, high efficiency and high accuracy etching becomes possible, providing the advantage that the material selection ratio is improved.
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Sumiya Masahiro
Tamura Hitoshi
Watanabe Seiichi
Yasui Naoki
Antonelli, Terry Stout & Kraus, LLP.
Dhingra Rakesh K
Hassanzadeh Parviz
Hitachi High-Technologies Corporation
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