Plasma processing apparatus and methods for removing...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With mechanical mask – shield or shutter for shielding workpiece

Reexamination Certificate

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Details

C118S715000, C118S720000, C118S721000, C118S504000, C118S505000, C216S057000

Reexamination Certificate

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07635418

ABSTRACT:
Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.

REFERENCES:
patent: 4534921 (1985-08-01), Fierkens et al.
patent: 4599970 (1986-07-01), Peterson
patent: 5208067 (1993-05-01), Jones et al.
patent: 5297897 (1994-03-01), Venrooij et al.
patent: 5529636 (1996-06-01), Nohara et al.
patent: 5961860 (1999-10-01), Lu et al.
patent: 6082375 (2000-07-01), Gealy et al.
patent: 6230719 (2001-05-01), Wensel
patent: 6417028 (2002-07-01), Wensel
patent: 6450074 (2002-09-01), Yong-Chang
patent: 6455479 (2002-09-01), Sahbari
patent: 6576867 (2003-06-01), Lu et al.
patent: 6629880 (2003-10-01), Kang et al.
patent: 6632746 (2003-10-01), Kanegae et al.
patent: 6652799 (2003-11-01), Seng et al.
patent: 6750082 (2004-06-01), Briar et al.
patent: 6815362 (2004-11-01), Wong et al.
patent: 6858086 (2005-02-01), Kang
patent: 7028696 (2006-04-01), Richardson et al.
patent: 7282452 (2007-10-01), Kanegae et al.
patent: 2001/0032706 (2001-10-01), Wensel
patent: 2002/0031622 (2002-03-01), Ippel et al.
patent: 2002/0032940 (2002-03-01), Sato
patent: 2002/0037819 (2002-03-01), Sahbari
patent: 2003/0005943 (2003-01-01), Singh et al.
patent: 2003/0045025 (2003-03-01), Coyle et al.
patent: 2003/0127502 (2003-07-01), Alvarez
patent: 2003/0193091 (2003-10-01), Yu et al.
patent: 2004/0053445 (2004-03-01), Briar et al.
patent: 2004/0106234 (2004-06-01), Sorg et al.
patent: 2004/0220066 (2004-11-01), Rutter
patent: 2004/0235303 (2004-11-01), Wong et al.
patent: 2004/0244423 (2004-12-01), Boontarika et al.
patent: 2005/0221599 (2005-10-01), Kanegae et al.
patent: 2005/0287815 (2005-12-01), Lai et al.
patent: 2006/0130873 (2006-06-01), Richardson et al.
patent: 2006/0131790 (2006-06-01), Getty et al.
patent: 2006/0163201 (2006-07-01), Getty et al.
patent: 2006/0201910 (2006-09-01), Getty et al.
patent: 2007/0052132 (2007-03-01), Gutierrez et al.
patent: 2007/0170602 (2007-07-01), Narasimalu et al.
patent: 2009/0065973 (2009-03-01), Jung et al.
patent: WO8607492 (1986-12-01), None
Office Action issued in a related matter, U.S. Appl. No. 11/420,840; dated as mailed on Apr. 15, 2009.
Office Action issued in a related matter, U.S. Appl. No. 11/021,341; dated as mailed on Apr. 7, 2009.
Office Action issued in a related matter, U.S. Appl. No. 11/021,341; dated as mailed on Sep. 29, 2008.
Austrian Patent Office, Search Report issued in corresponding Singapore Appl. No. 200703593-4 dated as mailed Jul. 7, 2009.

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