Plasma processing apparatus and focus ring

Details Plasma processing apparatus and focus ring Plasma processing apparatus and focus ring

2004-01-07

2010-12-14

MacArthur, Sylvia R. (Department: 1716)

Chucks or sockets

With magnetic or electrostatic means

C118S7230AN

Reexamination Certificate

active

07850174

ABSTRACT:
A plasma processing apparatus and a focus ring enables to perform uniform plasma processing over the entire surface of a substrate to be processed to thereby improve in-surface uniformity of plasma processing compared with conventional cases. The focus ring is disposed on a susceptor2, which serves to mount thereon a semiconductor wafer W and further functions as a lower electrode, to surround a periphery of the semiconductor wafer W. The focus ring6includes a ring member of a thin plate shape disposed to surround the periphery of the wafer W while maintaining a gap therebetween and a lower ring body installed below the semiconductor wafer and the ring member of the thin plate shape.

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