Plasma processing apparatus

Details Plasma processing apparatus Plasma processing apparatus

2007-10-30

2007-10-30

Hassanzadeh, Parvis (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345510, C156S345410, C156S345430, C118S7230ER, C118S728000

Reexamination Certificate

active

10663646

ABSTRACT:
A plasma processing apparatus for manufacturing a semiconductor device includes an apparatus for applying bias powers to a substrate to be processed and a material adjacent to the substrate, an apparatus for adjusting a feeding impedance for the bias power applied to the material, and an apparatus for adjusting feeding impedances for the bias powers to a plurality of positions on the substrate so as to make electrons projected to the substrate from the plasma uniform within a surface of the substrate.

REFERENCES:
patent: 5535507 (1996-07-01), Barnes et al.
patent: 5612851 (1997-03-01), Barnes et al.
patent: 5942039 (1999-08-01), Kholodenko et al.
patent: 5958265 (1999-09-01), Ogahara
patent: 6188564 (2001-02-01), Hao
patent: 6268994 (2001-07-01), Logan et al.
patent: 6270618 (2001-08-01), Nakano et al.
patent: 6363882 (2002-04-01), Hao et al.
patent: 6367413 (2002-04-01), Sill et al.
patent: 6557248 (2003-05-01), Shamouilian et al.
patent: 6585851 (2003-07-01), Ohmi et al.
patent: 2002/0005252 (2002-01-01), Masuda et al.
patent: 2002/0020494 (2002-02-01), Yokogawa et al.
patent: 2004/0177927 (2004-09-01), Kikuchi et al.
patent: 61-119686 (1986-06-01), None
patent: 2-65131 (1990-03-01), None
patent: 8-181107 (1996-07-01), None
patent: 8-316212 (1996-11-01), None

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